Vertiv

Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced the expansion of its end-to-end thermal chain with the availability of the Vertiv™ CoolChip CDU 2300 and Vertiv™ CoolChip Fluid Network Row Manifolds in Europe, Middle East and Africa (EMEA). These liquid cooling technologies support the growing demands of AI and high-density, next-generation compute to help customers deploy high-density infrastructure faster and operate more efficiently. The Vertiv CoolChip family is a core building block of the Vertiv thermal chain, an end-to-end portfolio including direct-to-chip cooling, immersion cooling, rear-door ...